| Specifications |
| Tolerance |
Values
<=10 Ohms ± 10%, >10 Ohms ± 10%, ± 5% |
| Applicable
E-Series |
E24(5%),
E12(10%)-Other values on request |
| Derating
|
From 70°C
to 350°C |
| TCR -Low
Values,IEC115.1, 4.8.4.2 & 2.2.20.2 |
450ppm/°C(Max)
|
| TCR -Mid
Values & High Values |
Std : <150ppm/°C;
On Request : 50ppm/°C, 20ppm/°C |
| Temperature
Range |
-55°C
to 350°C |
| Climatic
Category |
55 / 200
/ 56 |
| Solderability
|
95% Coverage
- MIL Std. 202F, Test 208 |
| Solvent
Resistance |
As per
IEC115-1,Clause4.30(Test XA of IEC-68-2-45) |
| Environmental
Specifications |
|
Test Methods
|
Test Conditions
|
Test
Limits
|
| Insulation
Resistance |
At 500V
DC, IEC115-1, Clauses-4.6, 2.2.19 |
10000 MOhms |
| Dielectric
Strength |
2000Vpeak
for 1 min, IEC 115-1, Clause 2.2.17 |
No Break
Down |
| Terminal
Strength |
Tensile
Test , IEC115-1, Clause 4.16, Test Ua 1 , IEC68-2-21 |
>50N
|
| Solderability
|
As per
MIL-STD 202F, Test 208, IEC 115, Clause 4.17.3 |
95% Coverage
|
| Endurance
at Rated Temperature |
Rated Power
@70°C(1.5hrs ON,0.5hrs OFF), IEC115-1, Clause 4.25 |
D
R < 5% + 0R05 |
| Damp Heat
Steady State |
90-95%
RH @40°C Ambient Temperature for 56days, IEC115-1, Clause 4.24 |
D
R < 5% + 0R05 |
| Resistance
to Soldering Heat |
10 Seconds
Dip in Solder Bath at 260°C, IEC115-1, Clause 4.18 |
D
R < 1% + 0R05 |
| Climatic
Sequence |
As per
IEC 115.1, Clause 4.23 |
D
R < 5% + 0R05 |
Low Surface Temperature
