|
Environmental
Specifications
|
| Test
Methods |
Test
Conditions |
Test
Limits |
| Short
Term Overload |
10
× Rated Power for 5 seconds |
D
R < 1% + 0R05 |
| Endurance
at Room Temperature |
Rated
Power @25°C (1.5 hrs ON, 0.5 hrs OFF) |
D
R < 5% + 0R05 |
| Thermal
Shock (Rapid Change of Temp.) |
5
Cycles, -55°C to 200°C |
D
R < 1% + 0R05 |
| Robustness
of Terminations |
As
per Clause C1-4.14 of BS-CECC 40201-002 |
D
R < 1% + 0R05 |
| Resistance
to Soldering Heat |
10
Seconds dip in Solder Bath at 260°C |
D
R < 1% + 0R05 |
| Vibration
|
Freq:
10-500Hz, Amplitude: 0.75mm/10g, Accln.: 6hrs in each Axis |
D
R < 1% + 0R05 |
| Bump
Test |
4000
Bumps at 40g Acceleration (Accln.) |
D
R < 1% + 0R05 |
| Long
Term Damp Heat |
90%
- 95% RH @ 40°C Ambient Temperature for 56 days |
D
R < 5% + 0R05 |
| Climatic
Sequence |
As
per Clause C1 - 4.20.8 of BS-CECC 40201-002 |
D
R < 5% + 0R05 |
| Temperature
Rise |
Max.
Surface Tempr. Rise @Rated Power and @25°C ambient |
T
< 380°C |
3W
to 14W Power Rating. 
